晶圆成型超精密激光开槽设备

用于3D封装和工厂自动化的晶圆成型激光开槽机

利用高频皮秒激光来减少开槽过程中的热效应和热积累

利用气浮平台实现高速精密微加工

光束整形减少能量损失

窄、宽光束可自动切换

实现高品质加工

通过三个光束同时加工的方法提高生产效率

Wafer formed laser grooving for 3D package & factory automation

Utilizing high-frequency picosecond lasers to reduce thermal effects and thermal accumulation during grooving

Implementing high-speed and precision micro machining using an air flotation platform

Beam shaping reduces energy loss

Narrow and wide beam can be automatically switched

Realize high-quality processing

Improving productivity through three spot processing methods

参数配置

功能描述

适用产品：半导体用8英寸、12英寸晶圆

主要功能：用皮秒激光去除钝化层、TEG、金属布线和Low-K材料

进出料方式：Ring Frame

尺寸：L2200 * W2000 * H1850mm

Applicable products: 8-inch and 12-inch wafers for semiconductors

Main function: Use picosecond laser to remove passivation layer, 

TEG, metal wiring, and Low-K materials

Import and export method: Ring Frame

Size: L2200 * W2000 * H1850mm