晶圆超精密激光开槽设备

利用高频率皮秒激光，开槽时降低开槽热影响和热堆积

采用气浮平台实现高速精密微加工

光束整形减少能量损失

窄、宽光束可自动交换

实现高品质加工

通过三个光束同时加工的方法提高生产效率

Utilizing high-frequency picosecond lasers to reduce thermal effects and thermal accumulation during grooving

Implementing high-speed and precision micro machining using an air flotation platform

Beam shaping reduces energy loss

Narrow and wide beam can be automatically switched

Realize high-quality processing

Improving productivity through three spot processing methods

参数配置

功能描述

适用产品：半导体用8英寸、12英寸晶圆

主要功能：用皮秒激光去除钝化层、TEG、金属布线和Low-K材料

进出料方式：Ring Frame

尺寸：L2200 * W2000 * H1850mm

Applicable products: 8-inch and 12 inch wafers for semiconductors

Main function : Use picosecond laser to remove passivation layer, TEG, metal wiring, and Low-K materials

Import and export method: Ring Frame

Size: L2200 * W2000 * H1850mm